Binghamton 3d printing

FAQ's

How much does your 3D printing service cost?

The cost of your 3D printed parts depends on factors such as part volume, part complexity, choice of material, which 3D printing technology is used, and if any post processing is required. For more details on these cost factors, see our article on the cost of 3d printing. To check the cost of your 3D printed part, simply upload a CAD (.STL) file and select your material and 3D printing technology to receive a quote within seconds.

How do you guarantee the quality of my prints?

Your parts are made by experienced 3D printing shops within our network. All facilities are regularly audited to ensure they consistently meet the Hubs quality standard. We include a standardized inspection report with every order and offer a First Article Inspection service on orders of 100+ units.

We have partners in our network with the following certifications, available on request: ISO9001, ISO13485 and AS9100.
Follow this link to read more about our quality assurance measures.

How do I select the right 3D printing process for my prints?

You can select the right 3D printing process by examining which materials suit your need and what your use case is.

By material: if you already know which material you would like to use, selecting a 3D printing process is relatively easy, as many materials are technology specific.
By use case: once you know whether you need a functional or visual part, choosing a process is easy.

For more help, read our guide to selecting the right 3D printing process. Find out more about Fused Deposition Modeling (FDM), Selective Laser Sintering (SLS), Multi Jet Fusion (MJF) and Stereolithography (SLA).

How can I reduce the cost of my 3D prints?

In order to reduce the cost of your 3D prints you need to understand the impact certain factors have on cost. The main cost influencing factors are the material type, individual part volume, printing technology and post-processing requirements.

Once these have been decided, an easy way to further cut costs is to reduce the amount of material used. This can be done by decreasing the size of your model, hollowing it out, and eliminating the need for support structures.

To learn more, read our full guide on how to reduce the cost of 3D printing.

Where can I learn more about 3D printing?

Our knowledge base is full of in-depth design guidelines, explanations on process and surface finishes, and information on how to create and use CAD files. Our 3D printing content has been written by an expert team of engineers and technicians over the years.

See our complete engineering guide to 3D printing for a full breakdown of the different 3D printing technologies and materials. If you want even more 3D printing, then check out our acclaimed 3D printing handbook here.

We have an extensive range of online resources developed to help engineers improve their capabilities.

Introductory guides

Design guides

Material guides

Applications

CAD & file preparation

Post processing & finishing

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• 50+ metals and plastics & 10 surface finishes


• Tolerances down to ±.0008” (0.020 mm)

• Lead times from 5 business days

See our CNC machining services

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Binghamton - NoE - 3D Printing

By Todd R. McAdam

Kaiming Ye has a term for the process he uses to build a team out of a bunch of multi-disciplined researchers with different goals, resources and from different New York campuses. 

He calls it “lunch.” 

The appetizer is a $150,000 grant from the SUNY Health Network of Excellence, enough to buy supplies for a couple months at the eight laboratories from five universities involved in the work. 

The main course is a hoped for $24 million grant from the National Science Foundation to develop a process to use 3-D printing technology to build on-demand implantable tissues and organs for treating otherwise incurable diseases – such as diabetes. 

And for dessert, there's the promise in 10 years of developing the technology far enough to build the most complex of human organs – such as the eye. 

“Those grants are incredibly competitive,” said Bahgat Sammakia, vice president for research at Binghamton University. “The win rate is typically 1 to 2 percent. The best thing you can do is to form a team that is the best in the world.” 

The team in this case came from Binghamton University, Neural Stem Cell Institute, SUNY-Albany, Cornell University, Rennselaer Polytechnic Institute, SUNY's College of Nanoscale Science and Engineering, and the University of Texas, Arlington. 

“I don't have special skills” in building teams, Ye said. “Bring them together, talk together. Share the vision.” 

Ye’s vision, shared over a lunch or two, is pretty compelling. 

Islet cells, produced in the pancreas, don’t survive beyond three months if cultures in a petri dish because they don’t mature properly. That’s because cells don’t grow effectively in isolation. They grow, develop and maintain their function in biochemical context with the cells around them. 

Ye’s plan uses a patient’s own cells. It would strip them down to a framework, like a stem cell. Then the 3-D process would add new material, piece by piece, until it produces a functioning specialized cell. They’re crafted from a patient’s own cells, so there’s no chance of rejection. 

Islet cells, among the simplest organs in the human body, are the first project. More complex organs – the liver, kidneys, lungs, heart, the eyes and even the brain – can eventually be built using a similar matrix. 

While Ye, a bio-engineer and former National Science Foundation program director, has a technology to re-program cells, he need the skills of leading-edge biomaterials experts, stem cell biologists, other biomedical engineers and biomechanical specialists. 

“You have to open your mind first. We've all collaborated in the past,” Ye said. “If the team members lose the faith, then the collaboration goes nowhere. Our team members are very collegial and collaborative. They are first-class scientists and leaders in the field.” 

Ye wasn't surprised when the initial funding requests were twice the $150,000 pot he had to work with. Negotiating effectively is part of the team process – and keeping the goal in mind is essential. In this case, better lives, saved lives, and a $24 million grant to make that happen. 

“We're very clear what the end product is,” Ye said. 

The willingness to hang together in those early days when funding is relatively light is critical to future success, Sammakia said. “They would have won a grant together and published some data together.” 

Grants like the $150,000 SUNY Networks of Excellence grant. “Without that, the chances of winning (larger grants) are greatly diminished,” Sammakia said. “Faculty members that are interested in research want to be with the best possible team. They will sacrifice a lot to be a part of a team like that.” 

“The money is the path; science is the goal,” Ye said. “If you put the money on the table, they'll work together.”

Tags Tags: Networks of Excellence , Binghamton University , Health and Medicine

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Cool the CPU in the data center - laser 3D printing will help / Sudo Null IT News The thermally conductive material is applied directly to the surface of the chip using 3D printing. According to experts, their solution can lower the operating temperature of processors in data centers by 10°C.

Let's talk about the technology and talk about other experimental methods of CPU cooling.

/ photo artistic bokeh CC BY-SA

How to print "metal thermal paste"

The developers of the technology applied a thin layer of a metal alloy with high thermal conductivity to the processor chip and, using a laser, "printed" channels for the coolant in it. For this, the method of selective laser sintering was used.

A layer of metal powder is evenly distributed on the silicon surface. Then the laser is turned on and the beam directed by the moving mirrors fuses the particles together according to the generated 3D model. The procedure is repeated many times - at each iteration, different sections of the final product are formed. The laser sintering itself takes place in less than a second.

The alloy that is applied to the chip consists of titanium, tin and silver. The last two are needed to reduce the melting point of the material. Thus, the metal remains in the liquid state longer, which helps to avoid deformation of the layer due to sudden solidification.

Selective laser sintering made it possible to form a metal layer a thousand times thinner than the diameter of a human hair. This allows the coolant to draw excess heat directly from the chip and eliminates the need for thermal paste.

What this technology can do

The specialists managed to obtain an alloy with a thermal conductivity of 39 W/(m•K), which is seven times better than other materials for thermal interfaces - thermal pastes or polymer compounds. This made it possible to reduce the temperature of the chip by 10°C compared to other cooling systems.

The new technology is designed to solve two problems: reduce energy costs in data centers and extend the life of processors (because they will overheat less). According to the developers, the invention will reduce the energy consumption of the world's data centers by 5% and will allow the IT industry to save up to $438 million annually.

So far, the technology has been tested only in laboratory conditions and it is not known how it will work in real data centers. However, in the near future, the researchers plan to patent their technology and conduct the necessary tests.

Who else is experimenting with chip cooling

Not only Binghamton University is working on chip cooling technologies. Their colleagues from the University of California for the first time synthesized ultrapure boron arsenide crystals with high thermal conductivity. The value obtained is close to 1300 W/(m•K), while diamond (which is considered one of the champions in thermal conductivity) has a value of 1000 W/(m•K).

The new technology will make it possible to create efficient heat removal systems in electronics and photonics. However, this requires solving a number of problems. Boron arsenide is difficult to obtain on an industrial scale - defects often occur during the synthesis of crystals, and toxic arsenic compounds are used in the production of the material.

Researchers at the University of California are also working on a solution to the problem of heat dissipation from processors. They suggested changing the structure of the chip itself. The idea is to create a silicon crystal structure in which phonons (quasiparticles that carry out heat transfer) will transfer heat at maximum speed.

Their technology is called "hole silicon". Tiny holes with a diameter of 20 nm are drilled into the board, which accelerate heat dissipation. In the case of an optimal arrangement of holes, the thermal conductivity of the silicon wafer increases by 30%.

This method is still far from being implemented - only the model is ready. The next step is to explore the potential of the technology and the possibility of application in real systems.

/ stock photo PD

What's next

The practical implementation of new heat removal technologies is still far away. All of them are either at the concept stage or at the prototyping stage. Although they have good potential, there is no need to talk about their widespread implementation in the data center market yet.

For this reason, data centers are now experimenting with other cooling methods. One of the latest trends is liquid cooling . According to a survey by the Uptime Institute, 14% of data centers around the world have already adopted the technology. Experts expect that this figure will increase in the future due to the increase in the density of equipment in the data center. Since with a large number of nearby servers, air cooling is difficult.

Another trend is AI systems for controlling the air conditioning units of the data center. According to research organizations, about 15-25% of data centers already use such machine learning algorithms. And it is expected that in the future, the popularity of intelligent technologies in the data center will only increase.

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technologies

Cool down the CPU in the data center - laser 3D printing will help

09/12/2018

Binghamton University (New York) has developed a new technology for cooling processors, which will eliminate thermal paste. The thermally conductive material is applied directly to the surface of the chip using 3D printing. According to experts, their solution can lower the operating temperature of processors in data centers by 10°C.

How to print "metal thermal paste"

The developers of the technology applied a thin layer of a metal alloy with high thermal conductivity to the processor chip and, using a laser, "printed" channels for the coolant in it. For this, the method of selective laser sintering was used.

A layer of metal powder is evenly distributed on the silicon surface. Then the laser is turned on and the beam directed by the moving mirrors fuses the particles together according to the generated 3D model. The procedure is repeated many times - at each iteration, different sections of the final product are formed. The laser sintering itself takes place in less than a second.

The alloy that is applied to the chip consists of titanium, tin and silver. The last two are needed to reduce the melting point of the material. Thus, the metal remains in the liquid state longer, which helps to avoid deformation of the layer due to sudden solidification.

Selective laser sintering made it possible to form a metal layer a thousand times thinner than the diameter of a human hair. This allows the coolant to draw excess heat directly from the chip and eliminates the need for thermal paste.

What this technology can do

Specialists have been able to obtain an alloy with a thermal conductivity of 39 W/(m•K), which is seven times better than other thermal interface materials such as thermal pastes or polymer compounds. This made it possible to reduce the temperature of the chip by 10°C compared to other cooling systems.

The new technology is designed to solve two problems: reduce energy costs in data centers and extend the life of processors (because they will overheat less). According to the developers, the invention will reduce the energy consumption of the world's data centers by 5% and allow the IT industry to save up to $438 million annually.

So far, the technology has been tested only in laboratory conditions and it is not known how it will work in real data centers. However, in the near future, the researchers plan to patent their technology and conduct the necessary tests.

Who else is experimenting with chip cooling

Not only Binghamton University is working on chip cooling technologies. Their colleagues from the University of California for the first time synthesized ultrapure boron arsenide crystals with high thermal conductivity. The resulting value approached 1300 W/(m•K), while diamond (which is considered one of the champions in thermal conductivity) has a value of 1000 W/(m•K).

New technology will allow creating efficient heat removal systems in electronics and photonics. However, this requires solving a number of problems. Boron arsenide is difficult to obtain on an industrial scale - defects often occur during the synthesis of crystals, and toxic arsenic compounds are used in the production of the material.

Researchers at the University of California are also working on a solution to the problem of heat dissipation from processors. They suggested changing the structure of the chip itself. The idea is to create a silicon crystal structure in which phonons (quasiparticles that carry out heat transfer) will transfer heat at maximum speed.

Their technology is called "hole silicon". Tiny holes with a diameter of 20 nm are drilled into the board, which accelerate heat dissipation. In the case of an optimal arrangement of holes, the thermal conductivity of the silicon wafer increases by 30%.

This method is still far from being implemented - only the model is ready. The next step is to explore the potential of the technology and the possibility of application in real systems.

What's next

The practical implementation of new heat removal technologies is still far away. All of them are either at the concept stage or at the prototyping stage. Although they have good potential, there is no need to talk about their widespread implementation in the data center market yet.

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